Necessity is the mother of invention, and advances in chip packaging are catching up to those in transistor design when it comes to working in three dimensions instead of the much more limited two.

AMD is leveraging one of its latest families of EPYC server CPUs, code-named Genoa X, in-house to run the electronic design automation (EDA) tools it uses for product development. Based on TSMC's 5-nm ...

AMD is raising the bar in its battle against Intel in the data center with a new lineup of EPYC CPUs that use its 3D packaging technology to triple the L3 cache, giving them a significant hike in ...